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Electronic Packaging Services

We provide electronic packaging services. Our in-house knowhow allows extra low void assemblies. Typical porosity counts are below 1%. Our packaging services are perfect for electronic components needing good thermal management.

Facility

Material Inlet Control

Cleaning station

Solder Printing

SPI

High Speed Pick-and-Place

General Purpose Pick-and-Place

AOI

Reflow Solder System

 

Cleaning

 

Electronic Testing Station